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Federal forms, ICRs, and supporting documents

Information Collection

U.S.-Japan Semiconductor Agreement Data Collection Program

IC 37258 under ICR 200402-0625-003 · OMB 0625-0211.

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Information Collection (IC) Details

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U.S.-Japan Semiconductor Agreement Data Collection Program
 
No Migrated
 
Voluntary
 

Document Type Form No. Form Name Instrument File URL Available Electronically? Can Be Submitted Electronically? Electronic Capability
Form ITA-4115P No No


    

32 0
   
Private Sector Businesses or other for-profits
 
   0 %

  Approved Program Change Due to New Statute Program Change Due to Agency Discretion Change Due to Adjustment in Agency Estimate Change Due to Potential Violation of the PRA Previously Approved
Annual Number of Responses for this IC 384 0 0 0 0 384
Annual IC Time Burden (Hours) 1,152 0 0 0 0 1,152
Annual IC Cost Burden (Dollars) 0 0 0 0 0 0

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            Blank fields in records indicate information that was not collected or not collected electronically prior to July 2006.